Finite element analysis of heat sink in term of thermal and temperature distribution with different chip power input

  • Authors

    • Mazlan Mohamed
    • Mohd Nazri Omar
    • Mohamad Shaiful Ashrul Ishak
    • Rozyanty Rahman
    • Muhamad Fahmi Mohd Roslan
    • Muhammad Nur Hafiz Shaidan
    • Zairi Ismael Rizman
    2018-04-06
    https://doi.org/10.14419/ijet.v7i2.15.11221
  • Chip power, Finite Element analysis, Heat sink, Temperature distribution

  • Abstract

    This paper presents the simulation of heat sink by using Workbench 18.0 Software to simulate the temperature distribution at different chip power input. 3D model of heat sink is generated using Design Modeler using the same dimension with experimental setup. The study was made for a heat sink mounted on the power source (Chip) under different types of chip powers. The results are presented in terms of temperature distribution when chip powers have been increased from 1 W to 10 W. The temperature distribution is been observed and it was found that the temperature distribution of the heat sink has lower temperature when power source at 1 W and increase significantly when the power source rise up to 10 W. The increase the temperature of heat sink is from 30.8ºC up to 96.2ºC estimated to be 212% the increase of temperature. The simulation also been verify by using different time step use during the simulation and using grid independency test to ensure the simulation result is accurate.

     

  • References

    1. [1] Mohamed M, Al Bakri AM, Wahab R, Zulhisyam AK, Iqbal AM, Amini MH, Mohammad AA (2015), Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software. Materials Science Forum 803, pp. 337–342.

      [2] Mazlan M, Mustafa Al Bakri AM, Wahab R, Mohd Sukhairi MR, Amini MH (2014), Comparison between thermal interface materials made of nano carbon tube (NCT) with gad pad 2500 in term of junction temperature by using CFD software, Fluent™. Materials Science Forum 803, 243–249.

      [3] Mazlan M, Kalam A, Loo HS, Al Bakri AM, Aziz MA, Khor CY, Sukhairi M (2013), Development of nano-material (nano-silver) in electronic components application. Advances in Environmental Biology 7, 3850–3858.

      [4] Mazlan M, Kalam A, Abdullah NR, Loo HS, Al Bakri AM, Aziz MA, Khor CY, Sukhairi MM (2013), The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™. Advances in Environmental Biology 7, 3843–3850.

      [5] Mazlan M, Rahim A, Al Bakri Abdullah MM, Iqbal MA, Razak W, Salim MS (2013), A new invention of thermal pad using sol-gel nanosilver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis. Advanced Materials Research 795, 158–163

      [6] Mazlan M, Rahim A, Al Bakri Abdullah MM, Razak W, Zubair AF, Najib YM, Bakir Azman A (2013), Thermal management of electronic components by using computational fluid dynamic (CFD) software, FLUENTTM in several material applications (epoxy, composite material & nanosilver). Advanced Materials Research 795, 141–147

      [7] Mazlan M, Rahim A, Iqbal MA, Al Bakri Abdullah MM, Razak W, Nor Hakim HM (2013), Numerical investigation of heat transfer of twelve plastic leaded chip carrier (PLCC) by using computational fluid dynamic, FLUENTTM software. Advanced Materials Research 795, 603–610

      [8] Mohamed M, Amini MH, Sulaiman MA, Abu MB, Bakar MN, Abdullah NH, Yusuf NA, Khairul M, Razab AA, Rizman ZI (2015), CFD simulation using wood (cengal and meranti) to improve cooling effect for Malaysia green building. ARPN Journal of Engineering and Applied Sciences 10, 9462–9467.

      [9] Mazlan M, Atan R, Mohd MA, Ahmad MI, Yusoff MH, Saad FN (2013), Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application. Advanced Materials Research 626, 980–988

      [10] Yusoff S, Mohamed M, Ahmad KA, Abdullah MZ, Mujeebu MA, Ali ZM, Idrus F, Yaakob Y (2009), 3-D conjugate heat transfer analysis of PLCC packages mounted in-line on a printed circuit board. International Communications in Heat and Mass Transfer 36, 813–819.

      [11] Hireholi S, Shekhar KS, Milton GS (2013), Experimental and theoretical study of heat transfer by natural convection of a heat sink used for cooling of electronic chip. International Journal of Engineering Inventions 2, 1–9.

      [12] Moore AL, Shi L (2014), Emerging challenges and materials for thermal management of electronics. Materials Today 17, 163–174.

      [13] Wu HH, Hsiao YY, Huang HS, Tang PH, Chen SL (2011), A practical plate-fin heat sink model. Applied Thermal Engineering 31, 984–992.

      [14] Narasimhan S, Majdalani J (2002), Characterization of compact heat sink models in natural convection. IEEE Transactions on Components and Packaging Technologies 25, 78–86.

      [15] Krueger WB, Bar-Cohen A (2004), Optimal numerical design of forced convection heat sinks. IEEE Transactions on Components and Packaging Technologies 27, 417–425.

      [16] Mohamed MM (2006), Air cooling characteristics of a uniform square modules array for electronic device heat sink. Applied Thermal Engineering 26, 486–493.

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  • How to Cite

    Mohamed, M., Nazri Omar, M., Shaiful Ashrul Ishak, M., Rahman, R., Fahmi Mohd Roslan, M., Nur Hafiz Shaidan, M., & Ismael Rizman, Z. (2018). Finite element analysis of heat sink in term of thermal and temperature distribution with different chip power input. International Journal of Engineering & Technology, 7(2.15), 90-93. https://doi.org/10.14419/ijet.v7i2.15.11221

    Received date: 2018-04-06

    Accepted date: 2018-04-06

    Published date: 2018-04-06