TRIZ Trends of Engineering System Evolution of Silver Sinter-ing Tools Used to Produce Power Module in Hybrids and Electric Vehicles
-
https://doi.org/10.14419/ijet.v7i3.17.21918 -
Abstract
Silver sintering is used for bonding of semiconductor dies to the substrate as part of a power module/device packaging. Power-module consisting inverters and converters are used to manage the electric drive systems in the hybrids and electric vehicles (HEVs). Many pressure-sintering tools and processes have been patented to produce reliable sintered silver joints for these power applications, and those invented by Siemens, Infineon Technologies, Danfoss, and Valtion (VTT) are analyzed based on the Theory of Inventive Problem Solving (TRIZ) framework. The level of inventiveness for each patent is evaluated, and respective function analysis is conducted to understand the interactions of the components in each sintering tool. This paper is expected to be useful to engineers who are interested in understanding the evolutionary patterns of a technical system especially silver sintering tools
-
References
[1] The International Council on Clean Transportation, “Global comparison of light-duty vehicle fuel economy/GHG emissions standardsâ€, accessed 19 June 2017, https://goo.gl/AX6Lns.
[2] S.T. Chua and K.S. Siow, “Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °Câ€, J. Alloys Compd. (687): 486-498 (2016).
[3] K.S. Siow, “Are sintered silver joints ready for use as interconnect material in microelectronic packagingâ€, J. Electron. Mater. 43(4): 947-961 (2014).
[4] A.S. Zuruzi and K.S Siow, “Electrical conductivities of porous silver made from sintered nanoparticles,â€Electron. Mater. Letter. 11(2): 315-321 (2015).
[5] S.A. Paknejad and S.H. Mannan, “Review of silver nanoparticle based die attach materials for high power/temperature applications,†Microelectronics Reliability. 70: 1-11 (2017).
[6] K.S. Siow and Y.T. Lin, “Identifying the development state of sintered silver (Ag) as bonding material in microelectronic packaging via a patent landscape study,†ASME. J. Electron. Packag. 138(2): 020804-13 (2016).
[7] K.S. Siow and E. Merigeault, “Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging,†Proceedings of Electronics Manufacturing Technology & 18th Electronics Materials and Packaging Conference pp.1-6 (2016).
[8] F.Yu, J. Cui, Z. Zhou, K. Fang, R. W. Johnson and M. C. Hamilton, “Reliability of Ag sintering for power semiconductor die attach in high- temperature applications,†IEEE Trans. Power Electron 32 (9): 7083-095 (2017).
[9] H. Seppa and M.Allen, US9011762B2 Valtion (21 April 2015).
[10] P.J. Terragno, “Patents as technical literature,†IEEE Trans.Professional omm (2): 101-104 (1979).
[11] M.N.A.M. Dali, J. A. Ghani, C.H.C. Haron and M. Rizal, “TRIZ approach for designing a new assisted tooling for dimple structure fabrication†J. Mech. Eng.,79-90 (2017).
[12] S. B. Hassan, J. A. Ghani, C. H. C. Haron and M. N. A. B. M. Dali, “Development of dynamic assisted tooling using TRIZ approach for dimple structure fabrication in milling process†J. Mech. Eng., 3, 23-32 (2017).
[13] H. Schwarzbauer, US4810672A Siemens (7 March 1989).
[14] R. Speckels, K. Guth and H. Hartung, US7851334B2 Infineon Technologies (7 December 2010).
[15] H. Ulrich and R. Eisele, WO2016050548A1 Danfoss (6 April 2016).
[16] S.Valeri, “The 5 levels of solutions explained,†accessed 13 May 2017, https://triz-journal.com/differentiating-among-the-five-levels-of-solution.
[17] R.Kalevi, “Levels of solutions,†accessed 13 May 2017. https://trizjournal.com/levels-solutions/
[18] G.Mazur, “Theory of Inventive Problem Solving (TRIZ),†accessed 13 May 2017. http://www.mazur.net/triz/
[19] Y.T. San, TRIZ-Systematic Innovation in Business and Management, First Fruits Sdn Bhd (2014), pp.105-113.
-
Downloads
-
How to Cite
Shyong, S. K., Foo, C. T., & Xin, Y. Z. (2018). TRIZ Trends of Engineering System Evolution of Silver Sinter-ing Tools Used to Produce Power Module in Hybrids and Electric Vehicles. International Journal of Engineering & Technology, 7(3.17), 244-249. https://doi.org/10.14419/ijet.v7i3.17.21918Received date: 2018-11-27
Accepted date: 2018-11-27