Analysis of SIW Crossover for 5G Beamforming Network Applications

  • Authors

    • Mohammed A. I. Matar Department of Electrical and Electronics Engineering, Faculty of Engineering, EskiÅŸehir Osmangazi University, EskiÅŸehir, Turkey
    • Gokhan Cinar Department of Electrical and Electronics Engineering, Faculty of Engineering, EskiÅŸehir Osmangazi University, EskiÅŸehir, Turkey
    • Özge Çınar Department of Electrical and Electronics Engineering, Faculty of Engineering, EskiÅŸehir Osmangazi University, EskiÅŸehir, Turkey
    2022-04-04
    https://doi.org/10.14419/ijet.v11i1.31993
  • Generalized Scattering Matrix Method (GSMM), microwave crossover, Mode-Matching Technique (MMT), Substrate Integrated Waveguide (SIW), 5G beamforming.
  • Abstract

    A Mode-Matching Technique (MMT) with Generalized Scattering Matrix Method (GSMM) are deployed to design and analyze H-plane SIW crossover operating at 26 GHz for 5G beamforming networks applications. The introduced crossover has an 0 dB transmission over more than 4 GHz bandwidth. During the MMT formulation, the crossover structure is divided into two symmetrical cascaded parts with each part having multi-port bifurcated sections. Due to the symmetrical structure, analyzing one half of the coupler with MMT has been sufficient for full analysis. The obtained S-parameter results from MMT are compared with full-wave CST simulator results.

  • References

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      vol. 33, no. 10, pp. 1018–1023, 1985.


      [12] T. S. Chu and T. Itoh, “Generalized scattering matrix method for analysis of cascaded and offset

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      34, no. 2, pp. 280–284, 1986.


      [13] G. Eleftheriades, A. Omar, L. Katehi, and G. Rebeiz, “Some important properties of waveguide

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      Transactions on Microwave Theory and Techniques, vol. 42, no. 10, pp. 1896–1903, 1994.


      [14] S. S. Hesari and J. Bornemann, “Substrate integrated waveguide crossover formed by orthogonal

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      [15] J. Wang and T. Ling, “Novel broadband design of siw directional coupler,†The Journal of

      Engineering, vol. 2019, no. 20, p. 6633–6636, 2019.


      [16] M. Boulesbaa, T. Djerafi, A. Bouchekhlal, and B. Mekimah, “Design of a directional coupler

      based on siw technology for x band applications,†in 2020 1st International Conference on

      Communications, Control Systems and Signal Processing (CCSSP), 2020, pp. 85–89.

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      directional coupled crossover with a wide bandwidth,†IEEE Microwave and Wireless

      Components Letters, vol. 30, no. 7, pp. 661–664, 2020.


      [2] A. Bagheri and G. Moradi, “A wideband single-layer crossover using substrate integrated

      waveguide to grounded coplanar waveguide transition,†Microwave and Optical Technology

      Letters, vol. 59, no. 11, pp. 2757–2762, 2017.


      [3] T.-S. Horng, “A rigorous study of microstrip crossovers and their possible improvements,†IEEE

      Transactions on Microwave Theory and Techniques, vol. 42, no. 9, pp. 1802–1806, 1994.


      [4] T. Becks and I. Wolff, “Analysis of 3-d metallization structures by a full-wave spectral-domain

      technique,†IEEE Transactions on Microwave Theory and Techniques, vol. 40, no. 12, pp. 2219–

      2227, 1992.


      [5] S. Karthikeyan, “Compact dual-band substrate integrated waveguide crossover with high

      isolation,†Progress In Electromagnetics Research Letters, vol. 38, p. 23–28, 2019.


      [6] Y. Zhou, K. Zhou, J. Zhang, C. Zhou, and W. Wu, “Miniaturized substrate integrated waveguide

      filtering crossover,†in 2017 IEEE Electrical Design of Advanced Packaging and Systems

      Symposium (EDAPS), 2017, pp. 1–3.


      [7] T. Djerafi and K. Wu, “60 ghz substrate integrated waveguide crossover structure,†in 2009

      European Microwave Conference (EuMC), 2009, pp. 1014–1017.


      [8] S.-Q. Han, K. Zhou, J.-D. Zhang, C.-X. Zhou, and W. Wu, “Novel substrate integrated waveguide

      filtering crossover using orthogonal degenerate modes,†IEEE Microwave and Wireless

      Components Letters, vol. 27, no. 9, pp. 803–805, 2017.


      [9] Y. Zhou, K. Zhou, J.-D. Zhang, Zhou, and W. Wu, “Substrate-integrated waveguide filtering

      crossovers with improved selectivity,†International Journal of RF and Microwave Computer-

      Aided Engineering, vol. 30, no. 3, 2019.


      [10] Z. Kordiboroujeni and J. Bornemann, “Design of substrate integrated waveguide components

      using mode-matching techniques,†in 2015 IEEE MTT-S International Conference on Numerical

      Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2015, pp. 1–3.


      [11] T. S. Chu, T. Itoh, and Y.-C. Shih, “Comparative study of mode-matching formulations for

      microstrip discontinuity problems,†IEEE Transactions on Microwave Theory and Techniques,

      vol. 33, no. 10, pp. 1018–1023, 1985.


      [12] T. S. Chu and T. Itoh, “Generalized scattering matrix method for analysis of cascaded and offset

      microstrip step discontinuities,†IEEE Transactions on Microwave Theory and Techniques, vol.

      34, no. 2, pp. 280–284, 1986.


      [13] G. Eleftheriades, A. Omar, L. Katehi, and G. Rebeiz, “Some important properties of waveguide

      junction generalized scattering matrices in the context of the mode matching technique,†IEEE

      Transactions on Microwave Theory and Techniques, vol. 42, no. 10, pp. 1896–1903, 1994.


      [14] S. S. Hesari and J. Bornemann, “Substrate integrated waveguide crossover formed by orthogonal

      te102 resonators,†in 2017 47th European Microwave Conference (EuMC), 2017, pp. 17–20.


      [15] J. Wang and T. Ling, “Novel broadband design of siw directional coupler,†The Journal of

      Engineering, vol. 2019, no. 20, p. 6633–6636, 2019.


      [16] M. Boulesbaa, T. Djerafi, A. Bouchekhlal, and B. Mekimah, “Design of a directional coupler

      based on siw technology for x band applications,†in 2020 1st International Conference on

      Communications, Control Systems and Signal Processing (CCSSP), 2020, pp. 85–89.

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  • How to Cite

    Matar, M. A. I., Cinar, G., & Çınar, Özge. (2022). Analysis of SIW Crossover for 5G Beamforming Network Applications. International Journal of Engineering & Technology, 11(1), 50-58. https://doi.org/10.14419/ijet.v11i1.31993

    Received date: 2022-02-26

    Accepted date: 2022-03-20

    Published date: 2022-04-04