Pre-particle filtration and moisture control by efficient purging in various inlet and outlet of a 450 mm wafer front-opening unified pod

  • Authors

    • Bill Chiu
    • Shih-Cheng Hu
    • Angus Shiue National Taipei University of Technology
    • Yu-Yun Shiue
    • Zhe-Yu Huang
    2015-04-04
    https://doi.org/10.14419/ijet.v4i2.4415
  • Front Opening Unified Pod (FOUP), Purge System, Moisture Control, Particle Filtration.

  • Abstract

    The trend toward narrower line width in semiconductor manufacturing has made contamination control more and more important. The presence of moisture in wafer containers, such as front opening unified pods (FOUP), can lead to the native oxide residues growth, metal corrosion, and thin film cracking on wafer surfaces. Accordingly, decreasing contamination methods and improving factory efficiency are continuously researched. Single or multi-layer particulate shields on top of wafers in FOUPs may be used to prevent pollutant accumulation. In addition, point-of-use (POU) filtration may also been used to control particle contamination in FOUPs during wafer transformation and storage. The demand for stricter filtration led to the usage of 0.10 and 0.20 µm membranes to control the contamination. However, with the introduction of finer membranes end users may have concerns about deleterious remainders on wafers from undergoing filtration. There are a total of 25 pieces of wafers in the FOUP and the arrangement is from the bottom (wafer No. 1) to the top (wafer No. 25) with arising manner. Purging FOUPs to expel moisture vapors with Clean Dry Air (CDA) is one of the most popular methods.

    There was no previous research for investigating the purge performance on new-generation 450mm FOUPs. This research aims to study main factors influencing the performance of the purge system on 450mm FOUPs, including moisture concentration, CDA flow rate, and filter pressure.

  • References

    1. [1] Mikkelsen, K. and Niebeling, T. "Characterizing FOUPs and evaluating their ability to prevent wafer contamination, Micro. (March 2001), pp. 10.

      [2] Hu, S.C. and Wu, T.M. and Lin, H.C. and Hsu, K."Design and evaluation of a nitrogen purge system for the front opening unified pod", Applied Thermal Engineering, Vol. 27, No. 8-9 (2007), pp. 1386-1393. http://dx.doi.org/10.1016/j.applthermaleng.2006.10.028.

      [3] Hu, Y.Z. and Tay, S.P. "Monitoring and purging dynamics of trace gaseous impurity in atmospheric pressure rapid thermal process", J. of Vac. Sci. & Techn. Vol. A21 (2003), pp. 676- 682. http://dx.doi.org/10.1116/1.1564023.

      [4] Genco, R. and Pitts, J. and G. Gallager, "Control microcontaminants with wafer cassette purging", Semiconduct. Int., April 1997, pp. 91-96.

      [5] Hu, S.C. and TSAO, J.M. "Purge of a Front Opening Unified Pod (FOUP) with Nitrogen for 300 mm Wafer Manufacturing", Jap. J. of Appl. Phys. 45(6A), Vol. 175 (2006), pp. 5269-5271.

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  • How to Cite

    Chiu, B., Hu, S.-C., Shiue, A., Shiue, Y.-Y., & Huang, Z.-Y. (2015). Pre-particle filtration and moisture control by efficient purging in various inlet and outlet of a 450 mm wafer front-opening unified pod. International Journal of Engineering & Technology, 4(2), 304-310. https://doi.org/10.14419/ijet.v4i2.4415

    Received date: 2015-02-27

    Accepted date: 2015-03-24

    Published date: 2015-04-04