1.
Mohamed M, Nazri Omar M, Shaiful Ashrul Ishak M, Rahman R, Fahmi Mohd Roslan M, Nur Hafiz Shaidan M, et al. Finite element analysis of heat sink in term of thermal and temperature distribution with different chip power input. IJET [Internet]. 2018 Apr. 6 [cited 2024 Nov. 21];7(2.15):90-3. Available from: https://sciencepubco.com/index.php/ijet/article/view/11221